Thermal Paste 10g SIL10

Unick Silicone Heat Compound Thermal Paste 10g SIL10

The Unick Silicone Heat Compound Thermal Paste 10g SIL10 is a grease-like silicone material impregnated with heat conductive metal oxides (zinc oxide). The Unick Silicone Heat Compound Thermal Paste 10g SIL10 transfers heat from semiconductors to heat sinks by filling pits and lands along metal surfaces.

Features

• Grease-like silicone compound with heat conductive metal oxides (zinc oxide)
• High thermal conductivity
• Low bleed properties
• Fills and smoothens pits and lands on metal surfaces for uniform heat transfer
• Transfers heat from semiconductors to heat sinks to reduce hotspots

Composition

• Dimethyl Polysiloxane (silicone): 28%
• Zinc Oxide: 65%
• Submicroscopic Pyrogenic Silica: 4%
• Stabiliser: 3%

Specifications

• Weight: 10 g
• Part number: SIL10
• Colour: Opaque white
• Odour: None
• Consistency: Penetration, worked and measured within 1 minute after working (ASTM D-217) = 260
• Bleed (after 24 hours @ 200ºC): 1.0%
• Evaporation (after 24 hours @ 200ºC): 1.0%
• Specific gravity at 25ºC: 2.3
• Thermal conductivity, K factor (cal/cm²/ºC/sec/cm): 0.0015
• Dielectric strength, kV at 0.1 mm (ASTM D-149): 1.0
• Boiling point: >250ºC
• Melting point: 1,970ºC
• Flash point: 230ºC
• Auto-ignition temperature: 425ºC
• Vapour pressure: >2 hPa
• Relative density: >/= 2.1 (@ 20ºC)